Contents

1) MOBILE REPAIRING

• SEMISTER -1A : o Basic of mobile communication and electronics. o Study of digital electronics. o Assembling & Disassembling of different types of mobile phones. o Use of various tools & instruments used in mobile phone repairing.
• SEMISTER -1B : o Details of various components used in mobile phones. o Study of basic parts of mobile phones.(speaker,ic,etc). o Testing of various parts with multimeter. o Use of Jhatka machine.o SEMISTER -1B o Details of various components used in mobile phones. o Study of basic parts of mobile phones.(speaker,ic,etc). o Testing of various parts with multimeter. o Use of Jhatka machine.
• SEMISTER-2A : a):- Basic of mobile communication and electronics. b):- Name of different BGA ICs. c):- Work of different BGA and Glass ICs. d):- How to recognise different ICs.
• SEMISTER -2B e):- Soldering & desoldering components using soldering iron. f):- Soldering & desoldering components using rework station. g):- Working on SMD/BGA ICs and the PCB.
• SEMISTER -3 a):- introduction of various software faults. b):- introduction of different flosher Box. c):- Unlocking of handset through codes and software. d):- Use of Secret codes. e):- Downloading.
• SEMISTER -4 a):- Faults finding & troubleshooting. b):- Steps of repairing hardware and software problems. c):- Circuit tracing, jumpering techniques and solutions. d):- Troubleshooting through schematic diagrams. e):- Repairing procedure for fixing other new hardware faults. f):- Advanced troubleshooting techniques.